• CPU: Intel Atom: E3845: 1.91 GHz, 4x core, (CPC1311-01 version); E3825: 1.33 GHz, 2x cores, (CPC1311-02 version) E3827: 1.75 GHz, 2x cores, (CPC1311-03 version)
• L1-Cache (32 KB of instructions, 24 KB of data); L2-Cache 1024 KB
• RAM: DDR3L-1066/1333 SDRAM up to 4 GB with ECC support
• SSD SATA Flash-drive: 4 GB (SLC NAND Flash)
• Watchdog timer: 1.2 sec …10 sec
• Operating temperature range: –40°C up to +85°C
• Power supply: from COM-Express connector with extended range (from 4.75 V to 20 V)
• Input is equipped with overvoltage protection and pulse interference protection
• OS support: Linux 2.6; QNX 6.5; Microsoft Windows Embedded Standard 8; Microsoft Windows Embedded
Standard 7
The mezzanine CPU-module COM Express mini, Type 10, 55x84 mm is designed for building of highly reliable embedded
power-efficient systems with compact sizes. The module corresponds to the "PICMG COM.0 COM Express Module Base
Specification Revision 2.1"
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CPU Intel Atom E3845: 1.91 GHz, 4x cores (CPC1311-01, CPC1311-03); Intel Atom E3825: 1.33 GHz, 2x cores (CPC1311-02, CPC1311-04) • Support of IA 64-bit/32-bit architecture • L1-Cache (32 KB of instructions, 24 KB of data) • L2-Cache 1024 KB • Support of Intel Streaming SIMD Extension 4.1 & 4.2 (SSE4.1 and SSE4.2) • Intel VT-x • Intel Digital Random Number Generator • Support of Intel SpeedStep Technology • Support of Deep Power Down Technology (C7) • Support of Intel Burst Technology RAM • DDR3L-1066/1333 SDRAM up to 4 GB, with ECC support • 64-bit data bus FLASH BIOS • 64 MB SPI-Flash • Modifiable within the system eMMC Flash drive: 8 GB • (versions CPC1311-01, CPC1311-03) FRAM 8 KB (I2C port) for storing configuration COM-Express COM.0 connector, Type 10 • 3(4) ports PCIe x1 (PCIe Base Spec. Rev 2.0), 5 GT/s • 4хUSB 2.0 (host), 1хUSB 2.0 (client), 1хUSB 3.0 SuperSpeed (host) • 2хSATA II (3-Gbps Gen.II) • 1хGbit Ethernet • 1хSPI (External Boot) • 1х LVDS/eDP; Digital Display Interface; DDI0 2560x1600 @ 50 Hz |
• 1х LPC (Specification Rev.1.1) • Buses SMBus, I2C
• HD Audio, Speaker Out • SDIO (combined with GPIO ports) • 1хRS-232 (TTL, 64 Byte FIFO, up to 4 Mbps), 1хRS-232 (TTL, 64 Bytes FIFO, up to 1 Mbps)/ CAN 2.0 B (TTL, up to 1 Mbps) • RTC battery Real-Time Clock Monitor of seven power supply voltages on SMBUS Watchdog timer (WDT) • 1.2 sec … 10 min Console I/O via serial ports (COM1/COM2) MTBF 200 000 hours Operating temperature range from –40°C up to +85°C • From - 40ºC to + 85ºC (CPC1311-01, CPC1311-02) • From 0ºC to + 70ºC (CPC1311-03, CPC1311-04) (temperature control on heat spreader) Power supply • From COM-Express connector with an extended temperature range (4.75 V … 20 V) Power consumption • CPC1311-01, CPC1311-03 ~15 W • CPC1311-02, CPC1311-04 ~12 W Weight no more than 0.15 kg Software compatibility • Linux 3.8.0 • QNX 6.6 • Microsoft Windows Embedded Standard 8 • Microsoft Windows Embedded Standard 7
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Configuration
|
Version |
Temperature range |
CPU |
RAM |
eMMC 8GB |
|
CPC1311-01 |
- 40°C … + 85° |
Intel Atom E3845 1.91 GHz, 4 cores |
4 GB 1333DDR3L |
+ |
|
CPC1311-02 |
0°C … +70° |
|||
|
CPC1311-03 |
- 40°C … + 85° |
Intel Atom E3825 1.33 GHz, 2 cores |
2 GB 1066 DDR3L |
- |
|
CPC1311-04 |
0°C … +70° |
• \LNX — Preinstalled Linux 3.8.0 (for versions with soldered eMMC)
• \WIN7E – Preinstalled OS Windows Embedded Standard 7 (for versions with soldered eMMC) • \COATED – conformal coating option
Delivery Checklist:
• CPC1311-xx Module ready-assembled with a heat-spreading plate and 5 mm racks (4 pcs.) • Installation kit:
1. set of racks with a height of 8 mm — 4 pieces
2. washers and screws for the racks (in order to fasten the module to the carrier-board) -4 pieces for each
3. jumper — 1 pcs
• Packaging
Additional accessories and cables:
• ACS30075 heatsink
• ACS30075-01 heatsink with a fan
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Tel: +86 139 2387 0899
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Anna Kedwin